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I/O Pin Connection

IP.com Disclosure Number: IPCOM000075743D
Original Publication Date: 1971-Nov-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Benarr, GM: AUTHOR [+4]

Abstract

In the manufacture of integrated circuits utilizing a photolithographic and plating process on ceramic substrates, it is necessary to establish a sound electrical connection between the I/O pin and the circuit personality. This electrical connection must be capable of withstanding repeated thermal excursions.

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I/O Pin Connection

In the manufacture of integrated circuits utilizing a photolithographic and plating process on ceramic substrates, it is necessary to establish a sound electrical connection between the I/O pin and the circuit personality. This electrical connection must be capable of withstanding repeated thermal excursions.

To this end, the thru vias in which metal I/O pins are to be swedged in place may be plated. The final connection between the circuit and the pin is made by applying solder to the areas to be joined. There are several methods by which this can be accomplished: 1) Dispense a solder loaded flux over the pin on the top side and reflow the assembly for connection. If connection on

both sides of the substrate is required, the assembly is

first passed thru a solder wave with the pins down, to

establish connection on the bottom side, and then the above

procedure is used for top side connection. 2) Prior to pin swedging, selectively plate solder thru the vias on top of the base metal. This is accomplished by

masking off, with photoresist, all but the vias to be

plated and electrolytically depositing solder thru the

vias. Once the pin is swedged in the via, the application

of flux to the solder and reflow of that solder will

establish the connection to the pin.

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