Browse Prior Art Database

Chip Joining Process

IP.com Disclosure Number: IPCOM000075838D
Original Publication Date: 1971-Nov-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Lavanant, F: AUTHOR [+2]

Abstract

As shown in Fig. 1, the electrical connection from the upper contact, typically a metallic ball 10, of a semiconductor chip 11 to a connection pin 12, which has been previously inserted then swaged in an insulating ceramic substrate 13, is made by using a strip 14.

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Chip Joining Process

As shown in Fig. 1, the electrical connection from the upper contact, typically a metallic ball 10, of a semiconductor chip 11 to a connection pin 12, which has been previously inserted then swaged in an insulating ceramic substrate 13, is made by using a strip 14.

The semiconductor chip 11 is backside mounted onto the ceramic substrate 13 by soldering, brazing or the like 15. The process of bonding the pretinned strip 14, with the pretinned ball 10 and the connection pin 12 will be described.

Referring to Fig. 2, substrates 13 are introduced in recesses 16 in which they are firmly held. The recesses have a common part forming a vacuum chamber 17, which is connected to a vacuum pump, not shown. A decal 18, including a backing plate with a plurality of conductive strips adhering to it by a soluble adhesive, is positioned over the set of substrates with each strip correctly registered with its respective upper contact 10 and pin head 12. Alternatively, the particular decal technique described in the publication entitled "Automatic mounting process", IBM Technical Disclosure Bulletin Vol. 12, No. 9, February 1970, page 1524 may be used. The decal sheet 18 is suitably maintained against the substrate by the combined effect of a frame 19 and the vacuum pressure from the vacuum chamber 17. An infrared heater 20 generating parallel beams of radiation supplies the apparatus with the necessary heat. After soldering, the decal backing plate 18 is remov...