Browse Prior Art Database

Plating Bath for High Temperature Solder Films

IP.com Disclosure Number: IPCOM000075856D
Original Publication Date: 1971-Nov-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Owen, CJ: AUTHOR

Abstract

An improved 90/10 Pb/Sn plating bath is comprised of: 0.2 to 2.0 g/l ethoxylated napthol sulfonic acid. 500 ml/l lead fluoroborate 10 gms/l fluoroboric acid 32 gms/l boric acid 0.5 gms/l ethoxylated napthol sulfonic acid preferred.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Plating Bath for High Temperature Solder Films

An improved 90/10 Pb/Sn plating bath is comprised of:
0.2 to 2.0 g/l ethoxylated napthol sulfonic acid. 500 ml/l lead fluoroborate 10 gms/l fluoroboric acid 32 gms/l boric acid
0.5 gms/l ethoxylated napthol sulfonic acid preferred.

The use of the above bath results in the decreasing of the outgassing tendency of plated solder during flow melting.

1