Browse Prior Art Database

Integrated Magnetic Memory Structure

IP.com Disclosure Number: IPCOM000075883D
Original Publication Date: 1971-Dec-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Archey, WB: AUTHOR [+5]

Abstract

The memory structure integrates semiconductor drive and sense circuit chips with magnetic film memory arrays. The structure is made by a process which simultaneously produces the magnetic array, chip mounting sites and all necessary interconnections.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 68% of the total text.

Page 1 of 2

Integrated Magnetic Memory Structure

The memory structure integrates semiconductor drive and sense circuit chips with magnetic film memory arrays. The structure is made by a process which simultaneously produces the magnetic array, chip mounting sites and all necessary interconnections.

Substrate 10, which may be made of ceramic such as unglazed alumina and having a dimension of 15 inches by 15 inches, has disposed thereon a heavy copper layer 12, preferably with a thin layer of chromium serving as a bonding medium. Suitable openings 14 are etched into copper layer 12 to selectively form, e.g., chip mounting sites isolated from the remaining portion of copper layer 12 which serves as a ground plane. A first insulating layer 16 which is made of polyimide is selectively applied to the etched copper layer 12. Over polyimide layer 16 is formed any conventional magnetic film structure 18, which may include coupled magnetic films 20, bit lines 22, word lines 24 and a keeper 26. A first layer of nickel plated copper strips 28 are also disposed over polyimide layer 16, with portions thereof in good electrical contact with selected portions of heavy copper layer 12. A second polyimide layer 30 is disposed over first level copper strips 28 and between word lines 24 and magnetic films 20. A second layer of copper strips 32 is disposed over second polyimide layer 30. Large insulation openings 34 forming elongated power/logic vias for power/logic line distribution are provide...