Browse Prior Art Database

Connector Interposer for Module To Board Connection

IP.com Disclosure Number: IPCOM000076072D
Original Publication Date: 1972-Jan-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Martyak, JE: AUTHOR [+3]

Abstract

When the pins 10A of pin-type modules 10 are soldered to printed circuit boards 11, it is extremely difficult to prevent peeling of the foil on the board when attempting to remove a defective module. As shown, an interposer-connector 12 comprising separate sheets 13 and 14 of, for example, a ceramic may be utilized in conjunction with connectors 15 to receive the pins 10A of the module 10 on one side thereof, and the pins 11A projecting from the circuit board 11.

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Connector Interposer for Module To Board Connection

When the pins 10A of pin-type modules 10 are soldered to printed circuit boards 11, it is extremely difficult to prevent peeling of the foil on the board when attempting to remove a defective module. As shown, an interposer-connector 12 comprising separate sheets 13 and 14 of, for example, a ceramic may be utilized in conjunction with connectors 15 to receive the pins 10A of the module 10 on one side thereof, and the pins 11A projecting from the circuit board 11.

To this end, each of the connectors 15 is formed as a dual-solder receivable bucket, having an upper bucket 15A and a lower bucket portion 15B separated by a wall 15C. The connectors 15 pass through the sheets 13 and 14, the sheets being sealed along their periphery by a flexible seal 16. If the solder placed in the bucket 15B has a higher melting temperature than the solder in 15A, heaters 17 positioned intermediate adjacent connectors 15 may be utilized to heat the solder in the bucket 15A without melting the solder in bucket 15B. In this manner, quick removal of the module 10 without removal of the interposer 12 from the pins 11A associated with the board 11 is facilitated. To inhibit the formation of an intermetallic, it is preferable that the solder buckets are formed of a nickel, which while having good solder wettability have a limited conductivity with the solder. Additionally, as illustrated, it is preferable that the heaters 17 be formed in bo...