Browse Prior Art Database

Wafer Pickup Head

IP.com Disclosure Number: IPCOM000076084D
Original Publication Date: 1972-Jan-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Leoff, A: AUTHOR [+3]

Abstract

Shown is a wafer pickup head utilizing a "Bernoulli" type wafer lifter with counteracting springs for maintaining orientation of the wafers during pickup, transfer and release. This wafer holder combines non-contact wafer handling of the "Bernoulli" type and a rigid hold on the wafer to maintain its orientation with reduced wafer damage because of built-in handling control.

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Wafer Pickup Head

Shown is a wafer pickup head utilizing a "Bernoulli" type wafer lifter with counteracting springs for maintaining orientation of the wafers during pickup, transfer and release. This wafer holder combines non-contact wafer handling of the "Bernoulli" type and a rigid hold on the wafer to maintain its orientation with reduced wafer damage because of built-in handling control.

The wafer holder shown in Fig. 1 is formed of a round body 1 with a gas jet input 2 in the center to lift and hold the wafer (with gas film separation), and four counteracting springs 3 located 90 degrees apart around the periphery for wafer locking in orient position and for keeping wafer orientation during pickup, transfer and release.

In operation, the wafer holder approaches the top surface of a wafer 4 and the four light springs 3, tipped with elastomeric soft pads 5, make contact with the wafer surface at four points around the wafer circumference. After contact and light spring deflection, the gas jet is gradually actuated and the wafer is drawn toward the holder body by created pressure differential and is counteracted by spring deflection. Thus the wafer is captured on the head and kept in position without disturbing orientation. When the wafer is released, the jet velocity is decreased gradually so that spring deflection is decreased gradually due to the decrease in jet holding force, so that the wafer may be placed gently on the receiving surface still maintaining...