Browse Prior Art Database

Surface Measurement Technique

IP.com Disclosure Number: IPCOM000076120D
Original Publication Date: 1972-Jan-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 22K

Publishing Venue

IBM

Related People

Feulner, R: AUTHOR [+2]

Abstract

A problem of providing good thermal coupling for a standard thermal couple exists. It is known that gold-to-gold provides a good ultrasonic bonding medium. However, generally it has been felt that gold would destroy the accuracy of a conventional thermal couple probe head, but now it is realized that a gold-to-gold ultrasonic bond can be made without hindering the operation of the thermal couple measuring device.

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Surface Measurement Technique

A problem of providing good thermal coupling for a standard thermal couple exists. It is known that gold-to-gold provides a good ultrasonic bonding medium. However, generally it has been felt that gold would destroy the accuracy of a conventional thermal couple probe head, but now it is realized that a gold-to-gold ultrasonic bond can be made without hindering the operation of the thermal couple measuring device.

A thermal couple device 10 is shown contacting a metal surface 12 supported by a semiconductor chip substrate 14. A gold-to-gold ultrasonic bond 16 provides excellent thermal coupling between the measuring device 10 and the metal 12 whose temperature characteristics are being measured.

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