Browse Prior Art Database

First Level Pattern Metal Wafer

IP.com Disclosure Number: IPCOM000076123D
Original Publication Date: 1972-Jan-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bratek, RJ: AUTHOR

Abstract

A stainless steel disc is made having mechanical dimensions identical to the semiconductor wafers being processed. After formation, this disc is processed through the photoresist process of the first mask series, exactly as if it were a semiconductor wafer. After the photoresist pattern is developed, the disc is nickel and copper plated to define the pattern created by exposure to the mask.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

First Level Pattern Metal Wafer

A stainless steel disc is made having mechanical dimensions identical to the semiconductor wafers being processed. After formation, this disc is processed through the photoresist process of the first mask series, exactly as if it were a semiconductor wafer. After the photoresist pattern is developed, the disc is nickel and copper plated to define the pattern created by exposure to the mask.

The plated disc is now used as an alignment aid in the following way. When a mask is first placed on the photoresist exposure machine, the plated disc is also inserted. The mask is then aligned with the plated disc, so that the silicon wafers subsequently exposed through the mask will have the pattern exposed thereon in registration with the pattern on the plated disc. By using this as an alignment aid for all masks, all wafers will be aligned in an identical fashion to a fixed standard, thus reducing the alignment problems in subsequent operations.

1