Browse Prior Art Database

Rotary Removal of Ultrasonically Bonded Wire

IP.com Disclosure Number: IPCOM000076175D
Original Publication Date: 1972-Jan-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Andrews, IW: AUTHOR

Abstract

Ultrasonic bonds between individual wires W and terminal pad P may be cleanly removed without disturbing the neighboring bonds.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Rotary Removal of Ultrasonically Bonded Wire

Ultrasonic bonds between individual wires W and terminal pad P may be cleanly removed without disturbing the neighboring bonds.

Bifurcated tool T, including a three mil wide by ten mil long channel C at the forked end, is positioned over the 2.5 mil diameter wire with the tool bisecting the site S of the bond. Controlled downward and oscillational torque forces are applied to the tool (25-30 grams and 0.025-0.030 ounce inches, respectively) severing the bond. Removal is sufficiently clean to preserve corrosion protecting integrity of a thin gold surface at the site so that another bond may be made to the same location.

Adjustment of the tool may be accomplished visually (with microscope) or with a programmed X-Y table.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]