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Polyparaxylylene Silane Copolymers for Conformal Coatings

IP.com Disclosure Number: IPCOM000076185D
Original Publication Date: 1972-Jan-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Eisenmann, DE: AUTHOR

Abstract

These copolymers provide improved organic dielectric materials for encapsulation of electronic circuit elements.

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This is the abbreviated version, containing approximately 100% of the total text.

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Polyparaxylylene Silane Copolymers for Conformal Coatings

These copolymers provide improved organic dielectric materials for encapsulation of electronic circuit elements.

Both vapor deposition and cold plasma techniques may be used to form copolymers of paraxylylene-silane, to produce a material having desirable properties of both paraxylylene and the high-temperature stability of the silane- silicone class of polymers. Starting materials should be low-molecular weight simple alkoxy silanes, such as vinyl silane, or silanols, and paraxylylene to minimize the possibility of formation of extraneous polymer products.

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