Browse Prior Art Database

Integrated Cooling for High Density Electronic Components

IP.com Disclosure Number: IPCOM000076221D
Original Publication Date: 1972-Jan-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Aakalu, NG: AUTHOR [+3]

Abstract

A plurality of heat generating components 12 are mounted on a substrate 14 which has a container 16 attached thereto in sealed relationship, such that the heat generating components are exposed to the inside of the container. A low-boiling point dielectric liquid 18 partially fills the container and completely covers the heat generating components. A vapor space 19 is located above the liquid level which is filled with internal fins 20, extending inward into the container, serving as a condenser for the dielectric liquid vapors. The outer walls of the container are surrounded by a liquid containing jacket 21 which is essentially a coldplate, for cooling the capsule. The coldplate 21 has a stepwise cross-sectional change to affect local control of cooling, as required.

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Integrated Cooling for High Density Electronic Components

A plurality of heat generating components 12 are mounted on a substrate 14 which has a container 16 attached thereto in sealed relationship, such that the heat generating components are exposed to the inside of the container. A low- boiling point dielectric liquid 18 partially fills the container and completely covers the heat generating components. A vapor space 19 is located above the liquid level which is filled with internal fins 20, extending inward into the container, serving as a condenser for the dielectric liquid vapors. The outer walls of the container are surrounded by a liquid containing jacket 21 which is essentially a coldplate, for cooling the capsule. The coldplate 21 has a stepwise cross- sectional change to affect local control of cooling, as required. Also, the top section of the coldplate 21 is designed with an impinged flow path to provide higher local heat transfer rates. An internal recirculation path is provided by a flow separator 22 within the liquid in the capsule.

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