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Thermoelectric Test Socket

IP.com Disclosure Number: IPCOM000076235D
Original Publication Date: 1972-Feb-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Bove, R: AUTHOR [+2]

Abstract

This test socket maintains close temperature control of a component during its evaluation.

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Thermoelectric Test Socket

This test socket maintains close temperature control of a component during its evaluation.

As shown, the test socket includes: a component receiving socket member A, in the body of which is embedded a temperature responsive member D, a thermoelectric device B mounted beneath the socket member for heating and cooling; and, a heat sink C supporting the thermoelectric device and socket member, to achieve maximum energy transfer from the thermoelectric device to the surrounding atmosphere and thereby permit close component temperature control during evaluation.

Besides maintaining accurate ambient temperature, the test socket structure has the following additional advantages. Both heating and cooling can be achieved in the same socket. The socket and related equipment are relatively small in size. Finally, since there are no moving parts, there is no wear, little maintenance and no acoustical noise developed.

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