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Browse Prior Art Database

Low Dielectric Glass Substrate

IP.com Disclosure Number: IPCOM000076254D
Original Publication Date: 1972-Feb-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 89K

Publishing Venue

IBM

Related People

Anderson, LC: AUTHOR [+2]

Abstract

Transmission speeds through modules and device circuitry can be significantly increased with a decrease in dielectric constant of the insulating material. This can be achieved as shown, by using a foam-like glass dielectric with controlled amounts of microscopic voids 1.

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Low Dielectric Glass Substrate

Transmission speeds through modules and device circuitry can be significantly increased with a decrease in dielectric constant of the insulating material. This can be achieved as shown, by using a foam-like glass dielectric with controlled amounts of microscopic voids 1.

The application of the foam-like glass is accomplished by spraying a fine glass powder with a plasma spray unit, which deposits molten glass onto a ceramic substrate. The substrate is preheated to a temperature just below the melting point of the glass prior to application of the dielectric. Metallurgy 2 can then be applied by conventional methods with additional layers of the foam-like glass 3 then being deposited as shown. Metallization and glass would be built up to provide the structure shown. The completed unit is provided with via holes, interconnected to semiconductor chips encapsulated and connected to external networks, not shown.

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