Browse Prior Art Database

Multiple Chip Via Test Fixture

IP.com Disclosure Number: IPCOM000076256D
Original Publication Date: 1972-Feb-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 65K

Publishing Venue

IBM

Related People

Markewycz, Z: AUTHOR

Abstract

Shown in A is a multichip via probe system representing visual alignment of probes with subsequent contact to be made on a multichip via pads, such as shown in B.

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Multiple Chip Via Test Fixture

Shown in A is a multichip via probe system representing visual alignment of probes with subsequent contact to be made on a multichip via pads, such as shown in B.

To contact the small and closely spaced multichip via pads, spring loaded wire probes are used such as shown in C. The wire probe is connected to a spring loaded assembly, the lower part of which is threaded to allow for a planarity adjustment of the probe tips at assembly. The upper end of the probe assembly is designed to accept a standard male plug or soldered wire providing a low-resistance path to the probe tip. In its mechanical form shown in D, the multicontact chip via head has its spring loaded wire probes held in a fixed array by an epoxy steel block assembly and illustrates the population of the channels from the spring loaded wire probes. The chip via heads are then grouped together, as shown in E, to conform with the substrate chip via pattern shown in B, with the probe tips adjusted to the desired protrusion at this assembly stage. In operation, the operator places a substrate 1 in the socket and clamp assembly 2 and 3, respectively, on a X-Y table to held the substrate square in a prealigned position. The operator views the chip land pattern on the substrate 1 and the probe head contacts 4 through a microscope 5 and beam splitter 6. Using two micrometer barrels 7, the operator adjusts the position of the substrate relative to the probe head. When the image o...