Browse Prior Art Database

Barrel Connector

IP.com Disclosure Number: IPCOM000076268D
Original Publication Date: 1972-Feb-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Kryzaniwsky, BR: AUTHOR

Abstract

To reduce the cost of the extra process step required in plating through holes in ceramic, or other type, modules such as through hole 11 of ceramic module 10, illustrated in Fig. 1, a high-density barrel-shaped connector 12 may be inserted in the hole 11 and bonded to the land 13 on the surface of the substrate.

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Barrel Connector

To reduce the cost of the extra process step required in plating through holes in ceramic, or other type, modules such as through hole 11 of ceramic module 10, illustrated in Fig. 1, a high-density barrel-shaped connector 12 may be inserted in the hole 11 and bonded to the land 13 on the surface of the substrate.

The connector 12 may be punched out of any suitable solder wettable material having resilient properties and formed with wedge-shaped portions 14, having a total depth approximating the depth of hole 11 in the substrate. Interdigitated with the wedge-shaped portions 14 are elongated rectangular members 15, which extend through the hole 11 and are bent over on both the upper and lower surface of the substrate 10, so as to facilitate ready joining of the material to the land pattern by solder.

The wedge-shaped members 14 preferably have a lower portion 16 which is splayed or formed outwardly so as to permit ready insertion of a pin 17, shown in phantom in Fig. 1. The form of the portion 16 and the bending of the wedge- shaped portion 14 inwardly insures wiping contact between the pin and the member 14.

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