Browse Prior Art Database

Metallizing Composition for Ceramic Substrates

IP.com Disclosure Number: IPCOM000076271D
Original Publication Date: 1972-Feb-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chance, DA: AUTHOR [+2]

Abstract

This metallizing composition when utilized on an alumina substrate, will retain its strength after several temperature cycles to 800 degrees C or greater.

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Metallizing Composition for Ceramic Substrates

This metallizing composition when utilized on an alumina substrate, will retain its strength after several temperature cycles to 800 degrees C or greater.

In the fabrication of modules, terminal pins are secured to the module with a layer of metallizing composition. The composition may be electrically conductive and may alternately be used to fabricate conductive patterns on and within the module. Prior or subsequent to adhering the pins to the module, the module may be subjected to high temperatures during further fabrication steps.

This metallizing composition, consisting of a mixture of tungsten and pure alumina in the ratio of 40-80% alumina by volume in any organic carrier for a suitable metallizing paste, retains its strength after a series of temperature cycles. The bonds formed are strong and do not degrade.

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