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Electroless Nickel Plating onto Nonactivated Copper

IP.com Disclosure Number: IPCOM000076322D
Original Publication Date: 1972-Feb-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Durfee, HF: AUTHOR [+3]

Abstract

This is an electroless nickel plating solution formulation which will electrolessly plate onto copper selectively without the use of a copper activation step. The electroless nickel plating solution is made up as follows:. 1) Sodium Hypophosphite 10 gm/1 2) Ammonium Citrate 65 gm/1 3) Ammonium Chloride 50 gm/1 4) NiCl(2) . 6 H(2)O 100 gm/1 The plating procedure is as follows: 1) Clean the copper with some physical abrasion, as for example, by brush means. 2) Dip the copper for approximately 1 minute in an alkaline cleaner, such as, PENNSALT* K2, 6-oz/gal at 150 degrees F. 3) Rinse the copper with deionized water. 4) Dip the copper for approximately 1 minute in 30% HCl. 5) Rinse the copper with deionized water.

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Electroless Nickel Plating onto Nonactivated Copper

This is an electroless nickel plating solution formulation which will electrolessly plate onto copper selectively without the use of a copper activation step. The electroless nickel plating solution is made up as follows:. 1) Sodium Hypophosphite 10 gm/1 2) Ammonium Citrate 65 gm/1 3) Ammonium Chloride 50 gm/1 4) NiCl(2) . 6 H(2)O 100 gm/1 The plating procedure is as follows: 1) Clean the copper with some physical abrasion, as for example, by brush means.
2) Dip the copper for approximately 1 minute in an alkaline cleaner, such as, PENNSALT* K2, 6-oz/gal at 150 degrees F. 3) Rinse the copper with deionized water. 4) Dip the copper for approximately 1 minute in 30% HCl. 5) Rinse the copper with deionized water. 6) Place the copper directly into boiling electroless nickel plating solution according to the above formulation for the required length of time to obtain the desired thickness. 7) Rinse well with deionized water and allow the copper to dry.

The pH of this electroless nickel plating solution is approximately 2.8. At this pH the rate of deposition is as follows: 10 minutes - 20 microinches 30 minutes - 40 microinches 60 minutes - 80 microinches.

Ammonium Hydroxide may be added to the solution to change the plating characteristics. Nickel will plate onto copper in the pH range of 2.8 to 8.0. At a pH of 7.0, the rate of deposition is as follows: 10 minutes - 50 microinches 30 minutes - 125 microinches 60 minu...