Browse Prior Art Database

Conduction Cooled Chip Module

IP.com Disclosure Number: IPCOM000076323D
Original Publication Date: 1972-Feb-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Dombrowskas, RJ: AUTHOR [+3]

Abstract

This is a method of cooling relatively high-power integrated circuit chips 1 which are joined to a ceramic module substrate 2 by the direct or metal ball-type connecting arrangements. A salient feature is the application of a conductive dispersion material 3 as the heat conducting medium between the back surface of an integrated circuit chip 1 and a suitable beat sink 4. The conductive dispersion material 3 is characterized by the following properties which renders it uniquely applicable to the heat transferring function: 1) High thermal conductivity. 2) High-electrical conductivity. 3) Intermediate viscosity to absorb the mechanical tolerances when interconnecting a common heat sink to a multiplicity of chips attached to a single module. 4) Stable properties over a wide range of temperatures.

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Conduction Cooled Chip Module

This is a method of cooling relatively high-power integrated circuit chips 1 which are joined to a ceramic module substrate 2 by the direct or metal ball-type connecting arrangements.

A salient feature is the application of a conductive dispersion material 3 as the heat conducting medium between the back surface of an integrated circuit chip 1 and a suitable beat sink 4. The conductive dispersion material 3 is characterized by the following properties which renders it uniquely applicable to the heat transferring function:
1) High thermal conductivity.
2) High-electrical conductivity.
3) Intermediate viscosity to absorb the mechanical tolerances when interconnecting a common heat sink to a multiplicity of chips attached to a single module.
4) Stable properties over a wide range of temperatures.
5) A conductive dispersion material which never cures or completely hardens.

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