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Improved Adhesion for Additive Circuitry Fabrication

IP.com Disclosure Number: IPCOM000076326D
Original Publication Date: 1972-Feb-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Angelo, RW: AUTHOR

Abstract

Additive circuitry processes depend upon the deposition of metal in selected areas of a circuit substrate by electroless and electrolytic techniques. One objective of such processes is a strong adhesive bond between the circuit substrate and the metal deposited thereon. Various surface preparation techniques function to improve the bond strength between the substrate and the deposited metal.

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Improved Adhesion for Additive Circuitry Fabrication

Additive circuitry processes depend upon the deposition of metal in selected areas of a circuit substrate by electroless and electrolytic techniques. One objective of such processes is a strong adhesive bond between the circuit substrate and the metal deposited thereon. Various surface preparation techniques function to improve the bond strength between the substrate and the deposited metal.

Test samples of KAPTON* have been prepared by sandblasting the KAPTON, then electroless plating with nickel, and electroplating with copper to an over-all thickness of approximately 1 mil. The electro-plated samples were then placed in a field of an induction heater for approximately 30 seconds. The products obtained by submission to a field of induction heating materially improved the adhesion between metal circuit line fabrications and the substrate. * Trademark of the E. I. du Pont de Nemours & Co.

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