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Hot Melt Protective Coating for Circuit Module Chips and Circuitry

IP.com Disclosure Number: IPCOM000076327D
Original Publication Date: 1972-Feb-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Cameron, JM: AUTHOR [+2]

Abstract

This is an application of a nonhardening hot melt material as an environmental protection medium for circuit module chips and circuitry. The method involves applying a predetermined amount of molten THERMOGRlP* 3043 hot melt material to the chip side of a circuit module substrate. The module cover is then installed and a granular type THERMOGRIP 1315 is applied to the substrate pin side of the module assembly. With the application of heat of 400 degrees F +/- 25 degrees F the hot melt materials flow over the entire inner surface of the substrate, covering all components and circuitry with a continuous hot melt coating. The compatible polyethylene based hot melt systems will meet and fuse together at the edges of the substrate.

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Hot Melt Protective Coating for Circuit Module Chips and Circuitry

This is an application of a nonhardening hot melt material as an environmental protection medium for circuit module chips and circuitry. The method involves applying a predetermined amount of molten THERMOGRlP* 3043 hot melt material to the chip side of a circuit module substrate. The module cover is then installed and a granular type THERMOGRIP 1315 is applied to the substrate pin side of the module assembly. With the application of heat of 400 degrees F +/- 25 degrees F the hot melt materials flow over the entire inner surface of the substrate, covering all components and circuitry with a continuous hot melt coating. The compatible polyethylene based hot melt systems will meet and fuse together at the edges of the substrate. Upon cooling, the material becomes tacky and resilient providing a hermetic seal for the entire circuit module. * Trademark of B. B. Chemical, Division of United Shoe Machinery Corp.

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