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Plating Thickness Measurement Technique

IP.com Disclosure Number: IPCOM000076329D
Original Publication Date: 1972-Feb-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

McGarigle, DM: AUTHOR

Abstract

Thickness measurements of the plated layer on the walls of through-holes for circuit modules are facilitated by including in the processed batch, a dummy substrate with a break-away section to expose the hole interiors.

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Plating Thickness Measurement Technique

Thickness measurements of the plated layer on the walls of through-holes for circuit modules are facilitated by including in the processed batch, a dummy substrate with a break-away section to expose the hole interiors.

In Fig. 1, a dummy ceramic substrate is constructed in two mating sections 1 and 2. Section 1 has partial through-holes 3 formed along one edge which are enclosed by respective flat surfaces 4 when the two sections are combined. The sections are held together along their common edges by photoresist 5 which serves as an adhesive and plating resist.

The dummy substrate is then processed normally with standard substrates. Upon completion of the metal plating, the two sections of the dummy substrate are easily broken apart so that measurement of the plating 6 (Fig. 2) can readily be made. A flat-hole surface is preferable, since it permits use of the more common thickness measuring devices in both horizontal and vertical directions.

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