Browse Prior Art Database

Terminating Flexible Film Circuitry

IP.com Disclosure Number: IPCOM000076330D
Original Publication Date: 1972-Feb-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Hoffman, KM: AUTHOR [+2]

Abstract

This is a structuring method of making a solder connection between flexible film circuitry and a printed-circuit board.

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Terminating Flexible Film Circuitry

This is a structuring method of making a solder connection between flexible film circuitry and a printed-circuit board.

The method comprises punching one or more holes in the flexible circuit element 1 at appropriate land positions 2 and then properly positioning the flexible circuit element 1 over a printed-circuit board 3. Solder balls 4 are placed in each of the holes in the flexible circuit element 1, followed by a heating of the solder to cause reflow which provides solder joints. Upon cooling the resulting solder joints are visible and take the shape of a rivet.

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