Browse Prior Art Database

Granular Hot Melt Application Technique

IP.com Disclosure Number: IPCOM000076370D
Original Publication Date: 1972-Feb-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Cameron, JM: AUTHOR

Abstract

This is a method of applying polyethylene-polyisobutylene material as a hot melt sealant for multipin devices as a protective sealant from environmental elements. The method involves applying the solid hot melt granules or powder to the pin side of circuit modules, or similar items. THERMOGRIP* 1315 granular material is ideally suited for this application because of its properties and characteristics. The hot melt granules or powder are randomly dispensed onto the pin side of the module to an approximate level of the pins. The modules and granules are then placed in an oven at approximately 425 degrees F. for a period of approximately 3 minutes. The module is then removed from the oven and allowed to cool either in ambient air or in a cooled environment.

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Granular Hot Melt Application Technique

This is a method of applying polyethylene-polyisobutylene material as a hot melt sealant for multipin devices as a protective sealant from environmental elements. The method involves applying the solid hot melt granules or powder to the pin side of circuit modules, or similar items. THERMOGRIP* 1315 granular material is ideally suited for this application because of its properties and characteristics. The hot melt granules or powder are randomly dispensed onto the pin side of the module to an approximate level of the pins. The modules and granules are then placed in an oven at approximately 425 degrees F. for a period of approximately 3 minutes. The module is then removed from the oven and allowed to cool either in ambient air or in a cooled environment.

The granular hot melt material produces consistently good sealing results irregardless of the pin pattern of the module, and is devoid of pin fouling which frequently occurs when other materials have been used. * Trademark of B. B. Chemical, Div., United Shoe Machinery Corp.

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