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Dendritic Wick for Heat Pipe Application

IP.com Disclosure Number: IPCOM000076371D
Original Publication Date: 1972-Feb-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Ingram, CG: AUTHOR [+2]

Abstract

The "wicking" action and thermal efficiency of a heat pipe can be enhanced by using as a "wick" a dendritic deposition of metal (Ni, Cu) on the walls of the heat pipe. This greatly increases the surface area of both the evaporator and condenser, providing a highly conductive thermal path from the heat source to the evaporating fluid, and from the condensing fluid to the condenser surface.

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Dendritic Wick for Heat Pipe Application

The "wicking" action and thermal efficiency of a heat pipe can be enhanced by using as a "wick" a dendritic deposition of metal (Ni, Cu) on the walls of the heat pipe. This greatly increases the surface area of both the evaporator and condenser, providing a highly conductive thermal path from the heat source to the evaporating fluid, and from the condensing fluid to the condenser surface.

The porosity of the dendritic formation enhances the capillary action required for heat pipe operation.

As shown in the drawing, the dendrites are formed by deposition of metallic powder (Ni) on the inside walls of a heat pipe, applying a magnetic field to obtain a "dendritic" formation of the particles, and then "fixing" the particles in this formation by subjecting the assembly to an electroless plating bath.

An advantage is increased performance by using a conductive dendritic surface to act as a wick and evaporator/condenser surface.

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