Browse Prior Art Database

Making Dual Core Arrays with Integral Cable

IP.com Disclosure Number: IPCOM000076397D
Original Publication Date: 1972-Feb-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Jackson, CR: AUTHOR [+3]

Abstract

A pair of coplanar core mats 10 and 11, with memory cores 12 held thereon, are secured in edgewise abutment to frame members 13 and 14 of the transfer frame 15 (as shown in Fig. 1). The cores 12 are wound with coordinate X-windings 16 and Y-windings 17, the Y-windings 17 being continuous through the cores 12 of both mats. The wired mats 10 and 11 are then separated by pulling the frame members 13 and 14 apart. This separation forms an intermat cable section 18 (as shown in Fig. 2). While the mats 10 and 11 are thus separated, with the Y-windings held taut, one or more flat dielectric sheets 19 having suitable adhesive are applied to the Y-windings in cable section 18.

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Making Dual Core Arrays with Integral Cable

A pair of coplanar core mats 10 and 11, with memory cores 12 held thereon, are secured in edgewise abutment to frame members 13 and 14 of the transfer frame 15 (as shown in Fig. 1). The cores 12 are wound with coordinate X- windings 16 and Y-windings 17, the Y-windings 17 being continuous through the cores 12 of both mats. The wired mats 10 and 11 are then separated by pulling the frame members 13 and 14 apart. This separation forms an intermat cable section 18 (as shown in Fig. 2). While the mats 10 and 11 are thus separated, with the Y-windings held taut, one or more flat dielectric sheets 19 having suitable adhesive are applied to the Y-windings in cable section 18. This laminated cable enables the Y-winding connections between the two core arrays to be maintained in precisely fixed arrangement, during the further processing of the core arrays into a memory array.

The wired core mats 10 and 11, with the encapsulated cable section 18, is then transferable from the transfer frame 15 to an assembly jig for attachment of the X-windings and Y-windings to various elements of a circuit-board structure. With this process, by placing the mats 10 and 11 in abutment, the winding of the threading of the Y-windings through the cores 12 is greatly simplified. Where the mats are in direct abutment and the cores 12 are reasonably close to the abutting edges, intermat guide means for the Y-windings are eliminated. The use of the enca...