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Thick Film Printing With a Laser

IP.com Disclosure Number: IPCOM000076429D
Original Publication Date: 1972-Mar-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Fugardi, JF: AUTHOR

Abstract

This thick-film deposition approach avoids the problem of rheology of clogged screening masks, and tapered cross sections of printed lines.

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Thick Film Printing With a Laser

This thick-film deposition approach avoids the problem of rheology of clogged screening masks, and tapered cross sections of printed lines.

A blanket layer of thick-film material 10, conductive, solderable, resistive or capacitive, is deposited on a substrate 12. A specially compounded paste is required containing an additive, such as BUTVAR* or a similarly acting material which remains after the appropriate drying cycle. When exposed through lens 13 to the intense infrared output of the laser beam 14, the BUTVAR volatilizes rapidly and expels out the surrounding material. An exact pattern is defined by placing a metal mask 15 between the blanket layer of dried paste and the laser. The metal mask is etched to obtain the required pattern on the substrate. The mask is made of metal as it is highly reflective to infrared radiation. * Trademark of Shawinigan Products Corp.

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