Browse Prior Art Database

Card Monolithic Chip on Card Subassembly

IP.com Disclosure Number: IPCOM000076438D
Original Publication Date: 1972-Mar-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Nestork, WJ: AUTHOR

Abstract

During conventional mounting of chips on a standard card, certain problems are normally encountered. Card stress causes chip joint fractures and additionally a chip must be bonded at the card manufacturing location. The present technique alleviates these problems and additionally allows the intermix of chips on cards with modules on the card.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Card Monolithic Chip on Card Subassembly

During conventional mounting of chips on a standard card, certain problems are normally encountered. Card stress causes chip joint fractures and additionally a chip must be bonded at the card manufacturing location. The present technique alleviates these problems and additionally allows the intermix of chips on cards with modules on the card.

A standard master card structure 10 is cut to provide a slot 12, having side V- grooves 14 and 16, in order to accommodate a subassembly card 18. Mounted on the subassembly card 18 are a plurality of chips interconnected, not shown, to a plurality of tabs 20. The tabs are disposed for engagement with a plurality of interconnection holes 22 located on the master card 10. Numerous interconnection techniques are available for joining the tabs 20 and holes 22, such as a solder bond. As desired, a plurality of device modules 24 and resistive capacitive passive elements, exemplified at 26, are readily mountable on the master card 10.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]