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CePd(3) for Thermoelectric Cooling and Temperature Measurement

IP.com Disclosure Number: IPCOM000076499D
Original Publication Date: 1972-Mar-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Gambino, RJ: AUTHOR [+3]

Abstract

A low-temperature thermocouple is prepared from CePd(3). The above curve illustrates that the thermopower of a CePd(3) thermocouple is greater than 100 uv/K over much of the temperature range. This is in contrast to thermopowers of the order of 10 uv/K or less for most metals at low temperatures.

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CePd(3) for Thermoelectric Cooling and Temperature Measurement

A low-temperature thermocouple is prepared from CePd(3). The above curve illustrates that the thermopower of a CePd(3) thermocouple is greater than 100 uv/K over much of the temperature range. This is in contrast to thermopowers of the order of 10 uv/K or less for most metals at low temperatures.

The best low-temperature thermocouples are made of Au + 2.1% Co vs Cu or Au + .03% Fe vs chromel. When the thermopower of CePd(3) thermocouples are compared with the best thermocouples, it is seen that Cepd(3) has an increased sensitivity by a factor of about 2.

The low-temperature thermoelectric cooling figure of merit for CePd(3) is substantially higher than for other metals. Cooling of 1/2 Degrees K at 77 Degrees K have been demonstrated.

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