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Apparatus to Obtain Optimum Control on Metal Vapor Deposition

IP.com Disclosure Number: IPCOM000076537D
Original Publication Date: 1972-Mar-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Hoekstra, JP: AUTHOR

Abstract

In the deposition of metal on a substrate in a metal evaporation technique, the problem which is encountered is evaporation shadowing. To prevent such shadowing, a monitor which is employed to monitor metal thickness during the evaporation is offset from the metal source to the substrate's axis. Such offsetting enables accurate measurement of the metal deposited on the substrate, as indicated by the monitor, when no changes in the density in the vapor stream occur during the evaporation. However, during the evaporation, the cross-sectional density distribution of the vapor stream is in a continuous state of change due to the geometry of the metal source, the presence of slag, the depletion of melt, etc.

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Apparatus to Obtain Optimum Control on Metal Vapor Deposition

In the deposition of metal on a substrate in a metal evaporation technique, the problem which is encountered is evaporation shadowing. To prevent such shadowing, a monitor which is employed to monitor metal thickness during the evaporation is offset from the metal source to the substrate's axis. Such offsetting enables accurate measurement of the metal deposited on the substrate, as indicated by the monitor, when no changes in the density in the vapor stream occur during the evaporation. However, during the evaporation, the cross- sectional density distribution of the vapor stream is in a continuous state of change due to the geometry of the metal source, the presence of slag, the depletion of melt, etc. Consequently, the monitor evaporation, the cross-sectional density distribution of the vapor stream is in a continuous state of change due to the geometry of the metal source, the presence of slag, the depletion of melt, etc. Consequently, the monitor cannot properly determine the thickness of the metal deposited on the substrate. the monitor with the substrate, thereby eliminating the inability to properly monitor the metal thickness because of changes in the vapor stream. The method solves a problem of thickness control in metal film evaporation, eliminates the effects of the changes in the distribution pattern of the metal vapor stream, and yields a high degree of accuracy in indicating the evaporative metal thickness on the substrate.

To carry out the method, there...