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Dynamic Thermocouple Probe for Slip Chip Joining Furnace

IP.com Disclosure Number: IPCOM000076643D
Original Publication Date: 1972-Apr-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Carlson, KA: AUTHOR [+3]

Abstract

A fine wire thermocouple 1, made up of 0.005'' or smaller alumel-chromel, platinum-platinum rhodium, iron-constantan, copper-constantan, or any dual-wire thermocouple material, is welded to a larger diameter thermocouple wire 2 of the same alloy whose diameter is 0.005'' or larger. The thermocouple is cemented into a hole 3 drilled into the substrate material. The fine wire is used to decrease the response time of the dynamic temperature profile of the substrate and the larger wire to obtain mechanical strength.

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Dynamic Thermocouple Probe for Slip Chip Joining Furnace

A fine wire thermocouple 1, made up of 0.005'' or smaller alumel-chromel, platinum-platinum rhodium, iron-constantan, copper-constantan, or any dual-wire thermocouple material, is welded to a larger diameter thermocouple wire 2 of the same alloy whose diameter is 0.005'' or larger. The thermocouple is cemented into a hole 3 drilled into the substrate material. The fine wire is used to decrease the response time of the dynamic temperature profile of the substrate and the larger wire to obtain mechanical strength.

The above dynamic thermocouple probe or any device used for the purpose of obtaining the dynamic temperature of a furnace or oven chamber can be evaluated, by comparing the output of the test device with another one or more thermocouples of considerably smaller diameter cemented to the top of the substrate material while undergoing thermal cycling. The thermal cycling is performed by heating the assembly in an oven or hot plate and intermittent cooling by impinging nitrogen or other gas on the surface of the assembly.

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