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Process Plated Serrated Module Edges

IP.com Disclosure Number: IPCOM000076646D
Original Publication Date: 1972-Apr-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Miller, LF: AUTHOR

Abstract

Electronic circuits can be produced by plating and etching conductive metal on the surface of insulator substrates. These circuits can be manufactured economically by mounting many such substrates in the oriented holes of a plating fixture 1 (partially shown) so that many can be processed at once. An adhesive seals the edges of the substrates to the sides of the holes in the plating rack and prevents plating on the side of the substrates. However, if the edges of the substrate are serrated or notched, these indented sections will also be plated and thus provide a through path for circuitry from one side of the substrate to the other without sacrifice of real estate.

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Process Plated Serrated Module Edges

Electronic circuits can be produced by plating and etching conductive metal on the surface of insulator substrates. These circuits can be manufactured economically by mounting many such substrates in the oriented holes of a plating fixture 1 (partially shown) so that many can be processed at once. An adhesive seals the edges of the substrates to the sides of the holes in the plating rack and prevents plating on the side of the substrates. However, if the edges of the substrate are serrated or notched, these indented sections will also be plated and thus provide a through path for circuitry from one side of the substrate to the other without sacrifice of real estate.

The substrates 2 are mounted in the plating fixture by first fastening a film of plastic over one side of the fixture so that all of the holes are covered. Then the plastic is punched in each hole leaving only a lip of plastic, which can be bent into the hole as the substrate is inserted. The plastic 3 is made to adhere to the side of each substrate by heating, solvent treatment, or other process. The entire rack with all the substrates can then be plated electrolessly, electrolytically, or other pertinent means. An etching resist is then applied and the circuitry etched from the metal. Alternatively, resist can be applied before the plating can be built up additively.

The indentations 4 on the sides of the substrate should be of such dimension, that the sealant ad...