Browse Prior Art Database

Bent Thermoset Printed Circuit Boards

IP.com Disclosure Number: IPCOM000076687D
Original Publication Date: 1972-Apr-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Memis, I: AUTHOR [+3]

Abstract

This is a process to construct a printed-circuit board, using a thermoset material such as epoxy-glass, in such a manner that the final laminate has a bend in it to a predetermined shape.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 91% of the total text.

Page 1 of 1

Bent Thermoset Printed Circuit Boards

This is a process to construct a printed-circuit board, using a thermoset material such as epoxy-glass, in such a manner that the final laminate has a bend in it to a predetermined shape.

Preferably a thin-face sheet, consisting of a copper foil with a dielectric less than 0.010'' thick, is fabricated and circuitized. The dielectric should be thin enough to permit bending without cracking.

The circuitized face sheet is then placed in a forming fixture and "B" stage prepreg is added to the dielectric side to achieve the required thickness.

The fixture is placed in a laminating press and formed with heat and pressure. The result is a circuitized bent printed-circuit board. Hole generation and shaping are done on the bent part.

Alternatively, a thick "B" stage/"C" stage face sheet process provides for circuitizing a thick laminate which is more easily processed. A copper clad one- sided thin-face sheet is fabricated. It is then laminated to a number of sheets of long-gel time "B" stage material using a short-heating cycle. The "B" stage material is advanced but still maintains "B" stage properties. The part is circuitized and placed in a forming fixture which bends the part and fully cures the material. Hole generation and milling can be done on the flat part.

Another thick "B" stage face sheet process is similar to the second process but a face sheet is not needed. The "B" stage material is laminated to copper foil using a shor...