Browse Prior Art Database

Three Dimensional Electrical Interconnection System

IP.com Disclosure Number: IPCOM000076688D
Original Publication Date: 1972-Apr-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Jackson, RN: AUTHOR [+2]

Abstract

This is a three-dimensional electrical interconnection system utilizing pluggable connectors and modular electronic assemblies. Referring to the drawings, the module is an assembly consisting of a substrate 3 and a carrier 4. The carrier 4 is a single piece plastic molding containing a cavity to hold the substrate 3. The carrier 4 material has sufficient flexibility to permit the substrate to be snapped in place during assembly.

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Three Dimensional Electrical Interconnection System

This is a three-dimensional electrical interconnection system utilizing pluggable connectors and modular electronic assemblies. Referring to the drawings, the module is an assembly consisting of a substrate 3 and a carrier 4. The carrier 4 is a single piece plastic molding containing a cavity to hold the substrate 3. The carrier 4 material has sufficient flexibility to permit the substrate to be snapped in place during assembly.

The carrier cavity is longer than the substrate 3 and permits the substrate to move relative to the longest dimension of the carrier 4 after the substrate has been snapped into place. The lengthwise motion of the substrate relative to the carrier 4 engages the "hairpin" contacts 5.

The substrate 3 is a metalized ceramic part with enclosures 6 for the semiconductor components 7. The metallization provides interconnections within the substrate and permits contact attachment. The "hairpin" contacts 5 project from the bottom surface of the substrate. Pin contacts 8 are attached to the upper surface of the substrate 3. In the construction, the pins 8 are connected to the metallization on the substrate and the "hairpin" contacts 5 are soldered into the metalized holes 9 in the substrate. The holes 9 can provide interconnections between metallization on the top and bottom surfaces of the substrate.

The carrier 4 is a permanent part of the module assembly and forms a protecting enclosure around...