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Fabricating Pinned Multilayer Boards

IP.com Disclosure Number: IPCOM000076690D
Original Publication Date: 1972-Apr-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Chellis, LN: AUTHOR [+2]

Abstract

This is a process for making muitilayer boards which eliminates the necessity of drilling thick composite board layers and plating through-holes therein. Interconnections are established through the medium of solid pins, thereby providing a more reliable connection against thermal shock and cycling.

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Fabricating Pinned Multilayer Boards

This is a process for making muitilayer boards which eliminates the necessity of drilling thick composite board layers and plating through-holes therein. Interconnections are established through the medium of solid pins, thereby providing a more reliable connection against thermal shock and cycling.

The process comprises: (Step 1) Drilling or punching a standard hole pattern in a dimensionally stable substrate, such as a laminate of polyester glass mat or sheet molding compound. (Step 2) Inserting tin-lead coated pins in the holes. The pins can have a straight knurl or be swaged to hold them in the holes during subsequent processing. (Step 3) fabricate ground and power planes as follows:
1) Laminate dry film adhesive with a prepunched land pattern to each side of copper foil. 2) Punch hole pattern in copper. 3) Tinilead plate exposed copper (or pass over solder-wave bath) to coat land areas and inside circumference of holes with SnPb. The dry film adhesive can be FEP TEFLON* or similar materials with restricted flow during lamination. (Step 4) Fabricate signal layers on a thin-epoxy glass core or film dielectric such as FEP-KAPTON** either by additive or subtractive circuitry techniques. Using a solder mask coating (prepunched FEP TEFLON, screened epoxy or photosensitive epoxy, for example) SnPb coated lands and holes are provided where connections to pins are required. (Step 5) Assemble ground planes, voltage planes and signal planes on one or bot...