Browse Prior Art Database

Pin Array Package with Heat Removal from Pin Side

IP.com Disclosure Number: IPCOM000076748D
Original Publication Date: 1972-Apr-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Hedeman, PT: AUTHOR [+2]

Abstract

Heat may be removed from the pin side of a package to the ambient side when the substrate is thermally inefficient and cannot be inverted.

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Pin Array Package with Heat Removal from Pin Side

Heat may be removed from the pin side of a package to the ambient side when the substrate is thermally inefficient and cannot be inverted.

A substrate includes suitable metalization (not shown) between a device, bonding pads (not shown) and plug type I/O pins (not shown). A heat conductive plate can be molded into the package during formation of the substrate, or prior to chip attachment to the substrate. The four wing sections of the plate fit into the channels of the substrates, such that in a raised position they are above the top surface of the substrate. In the raised position, the wing sections facilitate removal of heat from the pin side of the package.

The raised sections may also be used as a base for additional heat sinks. The channels in the substrate expose a cooling surface close to the device. The channels may be formed after the plate is attached to the substrate. The heat conductive lid is directly attached to the raised sections of the plate to seal the device from the atmosphere.

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