Browse Prior Art Database

Microcircuit Device

IP.com Disclosure Number: IPCOM000076871D
Original Publication Date: 1971-Jul-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Romankiw, LT: AUTHOR

Abstract

The isolation thickness required between crossing conductors in a microcircuit is reduced by an additional insulating layer on one conductor.

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Microcircuit Device

The isolation thickness required between crossing conductors in a microcircuit is reduced by an additional insulating layer on one conductor.

In microcircuit 11, e.g. a printed circuit or an integrated circuit, the thickness of insulation 16 is reduced between crossing conductors 12 and 18 on substrate 14, 15 is reduced by the provision of layer 20 on the surface of conductor 12 and a slight undercut of conductor 12. Layer 20 extends as an umbrella beyond the perimeter of conductor 12 to protect metal corners, the potential areas for electrical shorts.

Layer 20 on top of conductor 12 is easily provided by retaining the photoresist layer-through which metal pattern 12 has been etched from a continuous layer. To withstand high temperatures, a special insulating layer of organic or inorganic composition is deposited rather than a photoresist layer.

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