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Circuit Board Fabrication Utilizing Precision Type

IP.com Disclosure Number: IPCOM000076885D
Original Publication Date: 1972-May-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Drotar, JS: AUTHOR [+2]

Abstract

This is a method for fabricating flexible film circuitry on dielectric material 1, by the transfer of catalyzed filled polymers from a ribbon 2 to the dielectric material 1. Activator inks, impregnated in a typewriter ribbon 2, can readily be applied to a dielectric film material 1 through the operation of the type characters 3 of a typewriter 4, or similar apparatus. The activator inks serve to catalyze the dielectric film 1 which is then passed into an electroless plating bath 5 and then over a drying roll 6. This can result in either a dual or single-sided circuit, depending upon the requirements of the circuit designer.

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Circuit Board Fabrication Utilizing Precision Type

This is a method for fabricating flexible film circuitry on dielectric material 1, by the transfer of catalyzed filled polymers from a ribbon 2 to the dielectric material 1. Activator inks, impregnated in a typewriter ribbon 2, can readily be applied to a dielectric film material 1 through the operation of the type characters 3 of a typewriter 4, or similar apparatus. The activator inks serve to catalyze the dielectric film 1 which is then passed into an electroless plating bath 5 and then over a drying roll 6. This can result in either a dual or single-sided circuit, depending upon the requirements of the circuit designer.

This method provides a simple means of fabricating low volume specially designed printed-circuit cards and/or boards. The apparatus can be operated manually or by computer control.

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