Browse Prior Art Database

Automatic Chip Placement from Tape

IP.com Disclosure Number: IPCOM000076905D
Original Publication Date: 1972-May-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Bilous, O: AUTHOR [+2]

Abstract

Semiconductor chips which have been freed from a diced semiconductor wafer are placed along an adhesive tape with an accuracy of plus or minus 0.001 inch, and rolled upon reel 1 for storage. During the module assembly operation, reel 1 is mounted as shown in Figure 1, and the adhesive tape 2, bearing semiconductor chips 7, is unrolled passing over roller 3 and radius 4 and is then wound upon take-up reel 5. The arc subtended at radius 4 is smaller than the length of the chip 7 so that as adhesive tape 2 passes over radius 4, the chip 7 debonds and enters the alignment receptacle 6. With reference to Fig. 2, as the chip 7 enters the receptacle 6, a vacuum provided by vacuum line 8 forces the chip to the precision reference surface 9, thereby aligning chip 7 with respect to the module substrate 10.

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Automatic Chip Placement from Tape

Semiconductor chips which have been freed from a diced semiconductor wafer are placed along an adhesive tape with an accuracy of plus or minus 0.001 inch, and rolled upon reel 1 for storage. During the module assembly operation, reel 1 is mounted as shown in Figure 1, and the adhesive tape 2, bearing semiconductor chips 7, is unrolled passing over roller 3 and radius 4 and is then wound upon take-up reel 5. The arc subtended at radius 4 is smaller than the length of the chip 7 so that as adhesive tape 2 passes over radius 4, the chip 7 debonds and enters the alignment receptacle 6. With reference to Fig. 2, as the chip 7 enters the receptacle 6, a vacuum provided by vacuum line 8 forces the chip to the precision reference surface 9, thereby aligning chip 7 with respect to the module substrate 10. The solenoid operated vacuum pencil 11 suspends chip 7 over the substrate 10, and then executes a downward displacement so as to locate the chip 7 at the precise location desired on the substrate 10. A nitrogen jet 12 may be employed to assist in guiding the chip 7 as it debonds from tape 2 and moves into the receptacle 6. A plurality of substrates 10 may be moved along module track 13 in unison with the motion of tape 2, provide for automatic sequential placement of semiconductor chips on module substrates.

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