Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Stud/Glass De Wet Control

IP.com Disclosure Number: IPCOM000076927D
Original Publication Date: 1972-May-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Hoffman, HS: AUTHOR [+2]

Abstract

In module fabrication, chromium 1 is used between copper circuit patterns 2 and glass 3 to provide wetting and, therefore, to provide a seal between glass and metal. The copper studs 4 which interconnect the circuit layers, however, are not covered with chrome, which leads to a glass/stud interfacial void. This void creates contamination problems upon subsequent processing.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Stud/Glass De Wet Control

In module fabrication, chromium 1 is used between copper circuit patterns 2 and glass 3 to provide wetting and, therefore, to provide a seal between glass and metal. The copper studs 4 which interconnect the circuit layers, however, are not covered with chrome, which leads to a glass/stud interfacial void. This void creates contamination problems upon subsequent processing.

A process which avoids this problem comprises applying chromium 5 to the copper stud 4, thereby eliminating the void. Application can be accomplished by:
a) evaporation or sputtering, b) evaporation with 3-dimensional substrate rotation, c) ion plating, or d) electroless chromium deposition.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]