Browse Prior Art Database

Outgassing Analysis

IP.com Disclosure Number: IPCOM000077054D
Original Publication Date: 1972-Jun-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Yasko, RN: AUTHOR

Abstract

A nondestructive analysis of solder pads for organic content is performed by reflowing the solder with an electron beam in an evacuated chamber that is equipped with a residual gas analyzer.

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Outgassing Analysis

A nondestructive analysis of solder pads for organic content is performed by reflowing the solder with an electron beam in an evacuated chamber that is equipped with a residual gas analyzer.

A substrate with solder globules is placed in a vacuum chamber connected to suitable pumps such as zeolite sorption roughing pump and titanium ion pump. An electron gun is used to melt the solder globules on selected pads to produce outgassing from the trapped organic materials. A residual gas analyzer and an oscilloscope are then used to identify outgassed components. An ionization gage is connected to the vacuum chamber to monitor the pressure in the vacuum chamber.

Individual pads may be selected for outgassing analysis, in order to determine the optimum pad deposition parameters nondestructively. The technique is extendable to any two materials of which one having a larger thermal conductivity has a geometrical configuration similar to a printed-circuit line, while the other material of low-thermal conductivity is used as the substrate.

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