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Assembling High Density Printed Circuit Boards

IP.com Disclosure Number: IPCOM000077068D
Original Publication Date: 1972-Jun-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hromek, J: AUTHOR [+2]

Abstract

This is an improved fabrication method for producing a high-density multilayer printed-circuit board. The method comprises joining a plurality of flat conductive surfaces covered on one side with insulation. The conductive surfaces are coated with a controlled thickness of electrodeposited tin-lead (63:37) solder and a thin layer of tintillate. The layers are aligned in a fixture and joined by an application of pressure and heat for a predetermined period of time, wherein the solder is reflowed and the layer joining is effected. This method of circuit board fabrication is characterized by an elimination of the drilling and plating operations to produce small holes (less than 10 mil diameters) on a relatively high-density grid pattern.

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Assembling High Density Printed Circuit Boards

This is an improved fabrication method for producing a high-density multilayer printed-circuit board. The method comprises joining a plurality of flat conductive surfaces covered on one side with insulation. The conductive surfaces are coated with a controlled thickness of electrodeposited tin-lead (63:37) solder and a thin layer of tintillate. The layers are aligned in a fixture and joined by an application of pressure and heat for a predetermined period of time, wherein the solder is reflowed and the layer joining is effected. This method of circuit board fabrication is characterized by an elimination of the drilling and plating operations to produce small holes (less than 10 mil diameters) on a relatively high-density grid pattern.

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