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Screenable Plating Mask Material Formulation

IP.com Disclosure Number: IPCOM000077069D
Original Publication Date: 1972-Jun-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Herbaugh, DG: AUTHOR [+4]

Abstract

This is a screenable plating resist material formulation combining a plasticized, cellulose acetate buteyrate (CAB) hot melt resin with a solvent, ethylene glycol monoethyl ether acetate (CELLOSOLVE* acetate), producing a thixotropic coating material adapted to be applied to printed-circuit boards and the like by use of the silk screen process.

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Screenable Plating Mask Material Formulation

This is a screenable plating resist material formulation combining a plasticized, cellulose acetate buteyrate (CAB) hot melt resin with a solvent, ethylene glycol monoethyl ether acetate (CELLOSOLVE* acetate), producing a thixotropic coating material adapted to be applied to printed-circuit boards and the like by use of the silk screen process.

The preferred formula, by weight, is 50% CAB, 50% CELLOSOLVE acetate and 0.1% TIN-O-PAL**. The percentage solids of the coating may be varied from 45% to 55% depending upon the hole sizes, circuitry pattern and copper thickness.

The resin is put into solution by gradually adding to the solvent while stirring. Upon completion of the mixing cycle, the viscosity is approximately 17,000 centipoises at approximately 100 degrees F. This material formulation is characterized by its ability to conform to plated through-holes, circuit line edges and the inner surfaces of the holes. * Trademark of Union Carbide Corporation. ** Trademark of Geigy Industrial Chemical Corp.

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