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Browse Prior Art Database

Printed Circuit Card Rework Process

IP.com Disclosure Number: IPCOM000077184D
Original Publication Date: 1972-Jun-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 58K

Publishing Venue

IBM

Related People

Picard, S: AUTHOR

Abstract

This rework process, which uses two plastic sheets soldered to the raw card, i.e. the printed-circuit card to which components are mounted, yields clean and easy to test cards. The process steps are as follows: 1) Elimination of existing conductive paths on the raw card, e.g. by milling. 2) Implementation of new conductive paths.

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Printed Circuit Card Rework Process

This rework process, which uses two plastic sheets soldered to the raw card,
i.e. the printed-circuit card to which components are mounted, yields clean and easy to test cards. The process steps are as follows: 1) Elimination of existing conductive paths on the raw card, e.g. by milling. 2) Implementation of new conductive paths.

Two sheets, e.g. of TEFLON*, are cut to the dimensions of the raw card.

The first sheet carries no metallization. The second sheet carries a metallization on both faces, as shown in Fig. 1.

To define a new conductive path the metallized sheet is punched as shown in Fig. 2, to provide connections from A to B, C to D and E to F.

All unused lands are eliminated from the metallized sheet. Via holes are maintained at the same location as on the raw card.

All the lands of the nonmetallized sheet are also eliminated, except for those corresponding to the via holes of the metallized sheet.

Finally, the two plastic sheets are soldered to the backside of the raw card. * Trademark of E. I. du Pont de Nemours & Co.

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