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Determining Copper Concentration and Distribution in Evaporated Aluminum Copper Films

IP.com Disclosure Number: IPCOM000077278D
Original Publication Date: 1972-Jul-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Schwartz, GC: AUTHOR

Abstract

With aluminum-copper, aluminum-silicon, aluminum-copper-silicon alloy films anodized at constant current in a pore forming electrolyte, at a given current density, the rate of metal consumption depends upon alloy concentration as shown in the figure.

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Determining Copper Concentration and Distribution in Evaporated Aluminum Copper Films

With aluminum-copper, aluminum-silicon, aluminum-copper-silicon alloy films anodized at constant current in a pore forming electrolyte, at a given current density, the rate of metal consumption depends upon alloy concentration as shown in the figure.

During constant current anodization of aluminum-copper films in a pore forming electrolyte, there may be minima in the voltage curve and there minima correspond to peaks in the copper curves, as determined by an microprobe analysis at uniform copper concentration. There are no minima in the anodization curve. If the films have an aluminum cap, the thickness of the aluminum layer can be determined because of an inflection in the voltage curve at the aluminum/aluminum-copper interface.

It is believed sintered alloy films do not respond to this measurement.

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