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Method of Achieving Elevated Substrate Temperatures during Vacuum Deposition

IP.com Disclosure Number: IPCOM000077301D
Original Publication Date: 1972-Jul-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Horstmann, RE: AUTHOR [+2]

Abstract

During many vacuum deposition processes, it is necessary that the substrate be maintained at a temperature greater than 200 degrees C. In the past, the substrate has been backed by solid copper blocks or by a gallium coating. These techniques are not suitable at temperatures above 200 degrees C.

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Method of Achieving Elevated Substrate Temperatures during Vacuum Deposition

During many vacuum deposition processes, it is necessary that the substrate be maintained at a temperature greater than 200 degrees C. In the past, the substrate has been backed by solid copper blocks or by a gallium coating. These techniques are not suitable at temperatures above 200 degrees C.

To provide good control of substrate temperature during vacuum deposition processes, a perforated conducting disc is in contact with the substrate. Since the disc is perforated, heat will be radiated to the substrate and also conducted to the substrate by the perforated disc. Since gravity forces the disc into partial contact with the substrate, some heat sinking is provided, and substrate heats at the same rate as the disc. Copper is a suitable disc material.

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