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Laser Plating System for Printed Circuitry

IP.com Disclosure Number: IPCOM000077386D
Original Publication Date: 1972-Jul-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 20K

Publishing Venue

IBM

Related People

Anschel, M: AUTHOR

Abstract

Laser-plating (as opposed to electroplating) metals such as silver, copper, molybdenum, aluminum, nickel, etc. from insulators such as organo-metallic compounds is advantageous for forming highly conductive thin-metallic lines (<4 mil;

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Laser Plating System for Printed Circuitry

Laser-plating (as opposed to electroplating) metals such as silver, copper, molybdenum, aluminum, nickel, etc. from insulators such as organo-metallic compounds is advantageous for forming highly conductive thin-metallic lines (<4 mil; </-5 ohm resistance). The method and principle shown could be utilized for direct printed-circuit fabrication and as a repair technique for closing open holes in such systems.

Using a Neodymium pulsed laser or a CO(2) CW laser, silver, copper and other metals can be plated or deposited from organo-metallic compounds on substrates such as glass, ceramic, plastics or their equivalent.

For example, silver acetate (CH(3)CCOAg) when irradiated with a neodymium laser (1.06 mu) [with laser parameters at 1.0m-second pulse width, a 38 mm lens focused on the surface of the substrate (glass, ceramic, plastic) and 1050 volts] or CO(2) laser (10.6 mu) at 15-20 watts of power will deposit silver. The organic or insulating portion of the molecule undergoes transformation to give acetic acid, carbon dioxide and water which instantaneously vaporize off: viz,

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The rate, thickness and line definition of the circuitry or metallic pattern formed is dependent on the quantity of insulating (organo-metallic) material used, organic vs. metal % composition, the strength of the metal to nonmetal bonds, the number of metal to nonmetal bonds present, in addition to various laser settings, and means of a...