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Plating Fixture for via Deposition

IP.com Disclosure Number: IPCOM000077414D
Original Publication Date: 1972-Jul-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Bakos, P: AUTHOR [+2]

Abstract

To deposit Vias of a uniform height, a specially built plating fixture is utilized. The fixture is comprised of a conductive metal base 1, specially shaped nonconductive spacers 2, nonconductive lockers 3 and conductive, flexible clips 4. The metal base portion 1 of the fixture has two purposes: first, it serves as a conductive cathode and second, as a plating thief.

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Plating Fixture for via Deposition

To deposit Vias of a uniform height, a specially built plating fixture is utilized. The fixture is comprised of a conductive metal base 1, specially shaped nonconductive spacers 2, nonconductive lockers 3 and conductive, flexible clips
4. The metal base portion 1 of the fixture has two purposes: first, it serves as a conductive cathode and second, as a plating thief.

The spacer 2 provides three functions: first, as a sample holder 5, second, as a height adjuster, and third, as a ratio determinator. The correct ratio between the spacers 2 and the correct thickness, shape and size of the spacer 2 in combination with the base 1, enables optimum plating geometry selection between the anode 6 and the cathode 7. Uniform Via heights can be electrolytically deposited on the sample 5 utilizing the described plating fixture.

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