Browse Prior Art Database

All Plastic Pluggable Integrated Circuit Module

IP.com Disclosure Number: IPCOM000077509D
Original Publication Date: 1972-Aug-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

DeBoskey, WR: AUTHOR [+2]

Abstract

An integrated circuit (IC) module is fabricated as a single piece of plastic, including pluggable pins. Electrically conductive material is disposed on the module surface and pins for connection to a semiconductor member suitably fastened to a surface of the plastic member. Interconnections are made between the conductive material and the terminal pads of the semiconductor member. The unitary construction eliminates the need for lead frames and associated pin members.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 71% of the total text.

Page 1 of 2

All Plastic Pluggable Integrated Circuit Module

An integrated circuit (IC) module is fabricated as a single piece of plastic, including pluggable pins. Electrically conductive material is disposed on the module surface and pins for connection to a semiconductor member suitably fastened to a surface of the plastic member. Interconnections are made between the conductive material and the terminal pads of the semiconductor member. The unitary construction eliminates the need for lead frames and associated pin members.

In one form, an IC module can be fabricated as a plastic dual-in-line package of any number of pluggable pins. The plastic member 10 includes pin members 12 which may be of any cross-sectional configuration. A recess 14 is formed on a surface of the member 10, typically the surface opposite to that from which the pins protrude. A semiconductor member 16 is disposed in the recess in either a backside mounted or flip-chip position, by solder or conductive adhesive or the like. An electrically conductive material 18 is plated on the surface of the member 10 and the pins 12. The plastic surface can be prepared for plating by several established processes, such as the application of metal-filled epoxy or chemical activators or the like. The plating promoting materials can be applied to form the desired conductive pattern by screening, masking, selective dipping, blotting or rolling onto molded raised lands on the surface of the member 10, or selectively exp...