Browse Prior Art Database

Hot Gas Gun

IP.com Disclosure Number: IPCOM000077514D
Original Publication Date: 1972-Aug-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Cascio, SJ: AUTHOR [+2]

Abstract

A hot gas gun producing a directed gas stream, allows semiconductor circuit chips to be attached to organic substrates by solder reflow without substrate damage.

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Hot Gas Gun

A hot gas gun producing a directed gas stream, allows semiconductor circuit chips to be attached to organic substrates by solder reflow without substrate damage.

In Fig. 1, an inert gas, such as nitrogen, passes over variable-temperature heating element 1 in a quartz tube 2 and exits at nozzle 3. The heated gas flows into a movable duct 4 which is also connected to a vacuum source through valve
5. The gas issuing from orifice 6 impinges on the back of a chip 7 supported by solder mounds 8 on circuit lines 9 of organic substrate 10. The orifice is sufficiently small and is positioned so that the heated gas does not flow directly onto the substrate. A movable deflector 11 can be placed on duct 4 to bar gas flow into the movable duct.

Duct 4 can be used to move chips 7 from an orienting or supply device, not shown, to the attaching position shown. By opening valve 5, vacuum is applied to duct 4, sealed at its top by deflector 11, and can attract and hold the chip. Substrate 10 is supported on an X-Y table 12 to selectively position the substrate for chip placement upon release of the vacuum.

In Fig. 2, tube 2 is modified to accept a combined gas deflector vacuum holder 13. The deflector is vertically adjustable by rod 14 to vary the gas distribution on the chip. By using a hollow rod 14 connected to a vacuum source, the deflector can also be used to hold and place chips.

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