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Test Jig for High Density Module Conductors

IP.com Disclosure Number: IPCOM000077522D
Original Publication Date: 1972-Aug-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Bush, RF: AUTHOR

Abstract

This test for high-density module conductors accomplishes the following tests. 1) It checks for shorts between adjacent conductors. 2) It checks for opens in individual conductors. 3) It provides visible indications of faults 1 and 2.

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Test Jig for High Density Module Conductors

This test for high-density module conductors accomplishes the following tests. 1) It checks for shorts between adjacent conductors. 2) It checks for opens in individual conductors. 3) It provides visible indications of faults 1 and 2.

In the operation of the test jig, there is utilized the electroluminescence principle. Thus as shown in Fig. 1, if it is assumed that the conductors on a module have a layer-to-layer anisotrophy in each of the several layer configurations, the glass block substrate 10 can suitably be a coherent fiber optics faceplate to eliminate parallax. On the bottom surface of glass plate 10, there is provided a layer 12 of conductive transparent tin oxide. A five to eight mils blade 14 is disposed in a slot cut into plate 10 and appropriately spring loaded, so that it extends two to five mils below the surface of plate 10 when it is in a search position. On tin oxide layer 12, there is provided a layer 16 of a suitable plastic which is loaded with a phosphor, layer 16 being lapped smooth.

The module 18 to be tested is indexed so that the first row of contacts thereon touches blade 14, which may suitably be a contact bar such as is shown in Fig. 2. Blade 14 has applied thereto an AC voltage from source 22, which has a frequency suitable for rendering the electro-luminescent area at maximum brightness; a suitable voltage being 30-40 volts at 400 cps with a very low current. When blade 14 makes contact w...